Informationen über Wafer Level CSP
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Synergetix interposers are revolutionizing the testing of wafer-level chip scale packages (WLCSPs) in vertical probing applications. Test engineers are realizing tremendous savings in cost of ownership as Synergetix delivers a highly reliable, easily maintained, and eminently capable solution for this rapidly emerging form of test. Where engineers were previously required to use expensive and difficult to maintain vertical probing solutions, Synergetix interposers can:, Be implemented at a fraction of the initial cost and lead time as compared to traditional technologies., the same time produce a radical improvement in maintenance downtime and contact life. Synergetix sockets for production test of packaged devices are well known for their extreme durability and ease of maintenance. Now, Synergetix brings this same degree of ease to the wafer probing level. A total Synergetix WLCSP interposer solution is typically less than 20% of the cost of a comparably effective vertical probing tool.
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